View TDA8575_150357.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA8575 Ground noise isolation amplifier
Preliminary specification File under Integrated Circuits, IC01 1996 Jul 29
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
FEATURES * High common mode rejection up to high frequencies * Reduced dependency of common mode rejection on source resistance * Low distortion * Low noise * AC and DC short-circuit safe * Few external components * ESD protected on all pins. GENERAL DESCRIPTION
TDA8575
The TDA8575(T) is a two channel amplifier with differential input and single-ended output for use in car audio applications. The differential amplifier has a gain of 0 dB, a low distortion and a high common mode rejection. The TDA8575T comes in a 16 pin SO package and TDA8575 comes in a 16 pin DIP package. The TDA8575(T) is developed for those car audio applications where long connections between signal sources and amplifiers (or boosters) are necessary and ground noise has to be eliminated.
QUICK REFERENCE DATA SYMBOL VCC ICC Gv Vo(rms)(max) SVRR CMRR THD Vno Zi Zo PARAMETER supply voltage supply current voltage gain maximum output voltage (RMS value) supply voltage ripple rejection common mode rejection ratio total harmonic distortion noise output voltage input impedance output impedance Rs = 0 THD = 0.1% VCC = 8.5 V CONDITIONS 5 - -0.5 - 55 - - - - Vo(rms) = 1 V; f = 1 kHz - MIN. TYP. 8.5 12.6 0 1.7 60 80 0.005 3.7 108 - MAX. 18 15 +0.5 - - - - 5 - 10 UNIT V mA dB V dB dB % V k
ORDERING INFORMATION TYPE NUMBER TDA8575T TDA8575 PACKAGE NAME SO16 DIP16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm plastic dual in-line package; 16 leads (300 mil); long body VERSION SOT109-1 SOT38-1
1996 Jul 29
2
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
BLOCK DIAGRAM
TDA8575
handbook, full pagewidth
INL+
1 108 k
12
OUTL
VI
IV
INL-
5 360 k 0.5(VCC - 0.7) + 0.7 VCC 0.68(VCC - 0.7) + 0.7 16 VCC
8
TDA8575(T)
SVRR
REFERENCE
0.68(VCC - 0.7) + 0.7
9
GND
360 k INR- 6 108 k VI IV
0.5(VCC - 0.7) + 0.7
INR+
7
11
OUTR
MGE829
Fig.1 Block diagram.
1996 Jul 29
3
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
PINNING SYMBOL INL+ n.c. n.c. n.c. INL- INR- INR+ SVRR GND n.c. OUTR OUTL n.c. n.c. n.c. VCC PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 positive input left not connected not connected not connected negative input left negative input right positive input right supply voltage ripple rejection ground not connected output voltage right channel output voltage left channel not connected not connected not connected supply voltage DESCRIPTION
TDA8575
handbook, halfpage
INL+ n.c. n.c. n.c. INL- INR- INR+ SVRR
1 2 3 4
16 VCC 15 n.c. 14 n.c. 13 n.c.
handbook, halfpage
INL+ n.c. n.c. n.c. INL- INR- INR+ SVRR
1 2 3 4
16 VCC 15 n.c. 14 n.c. 13 n.c.
TDA8575T
5 6 7 8
MGE828
TDA8575
12 OUTL 11 OUTR 10 n.c. 9 GND 5 6 7 8
MGE827
12 OUTL 11 OUTR 10 n.c. 9 GND
Fig.2 Pin configuration TDA8575T.
Fig.3 Pin configuration TDA8575.
1996 Jul 29
4
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
FUNCTIONAL DESCRIPTION System description To enable a high common mode rejection a new system setup is used. The voltage to current converter, referred to as V I in the block diagram of Fig.1, replaces the resistors that can be seen in the conventional system solution. Both systems are shown in Figs 4 and 5. In the conventional system the common mode rejection is limited by the matching properties of the resistors resulting in a CMRR of 60 dB maximum. Using the new system setup a CMRR of 80 dB is achieved. Power on In Fig.6 the preferred input capacitor values are shown. If the capacitor C2 = 22 F connected to the IN- inputs had to be charged by the 0.5Vcc voltage source a charge time 360 k of 5 = 5 x ------------------ x 22 F = 20s would be required. 2
TDA8575
This is inconvenient for most applications and therefore the TDA8575(T) is equipped with a quick charge circuit. On power-on the quick charge circuit charges the capacitor C2 connected to the IN- pins. The quick charge circuit consists of a voltage buffer and a control circuit (referred to as `reference and power check' in Fig.6) that monitors the supply voltage VCC. If the supply voltage rises more than 2 V the voltage buffer is switched on. After charging C2 the voltage buffer is switched off. The charge time of C2 will equal the charge time of C4, the SVRR capacitor.
handbook, halfpage handbook, halfpage
Vi
Vo Vi VI IV Vo
0.5 VCC
MGE830
0.5 VCC
MGE831
Fig.4 Conventional system.
Fig.5 New system using V I converters.
1996 Jul 29
5
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
handbook, full pagewidth
C1 220 nF Rs 5 k Vi(L)
INL+ 1 108 k INL- 5
TDA8575(T)
VI
VOLTAGE BUFFER
360 k
switch off 16 VCC
C2 22 F Vcm REFERENCE AND POWER CHECK
8 SVRR
C4 47 F 9 GND
Vi(R) INR- 6 Rs 5 k C1 220 nF INR+ 7 108 k
360 k
switch off
VI
VOLTAGE BUFFER
MGE832
Fig.6 Quick charge circuit.
1996 Jul 29
6
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC IORM Vsc Tstg Tamb Tj supply voltage repetitive peak output current AC and DC short-circuit safe voltage storage temperature operating ambient temperature junction temperature PARAMETER CONDITIONS operating - - - -55 -40 - MIN.
TDA8575
MAX. 18 40 18 +150 +85 +150 V
UNIT mA V C C C
THERMAL CHARACTERISTICS SYMBOL Rth j-a TDA8575 (DIP16) TDA8575T (SO16) QUALITY SPECIFICATION Quality according to UZW-BO/FQ-0601, if this type is used as an audio amplifier. DC CHARACTERISTICS VCC = 8.5 V; Tamb = 25 C; R L = 10 k; in accordance with application circuit (see Fig.9). SYMBOL VCC ICC VO Note 1. The DC output voltage with respect to ground is approximately 0.5VCC. PARAMETER supply voltage supply current output voltage note 1 CONDITIONS Vi = 0 V 5 - - MIN. TYP. 8.5 12.6 4.7 MAX. 18 15 - V mA V UNIT PARAMETER thermal resistance from junction to ambient in free air 75 110 K/W K/W VALUE UNIT
1996 Jul 29
7
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
AC CHARACTERISTICS VCC = 8.5 V; f = 1 kHz; Rs = 0 k; R L = 10 k; Tamb = 25 C; in accordance with application circuit (see Fig.9). SYMBOL Gv cs Gv fro(L) fro(H) Zi Zo Vno THD voltage gain channel separation channel unbalance low frequency roll-off high frequency roll-off input impedance output impedance THD = 1% unweighted; note 3 Vi(rms) = 1 V Vi(rms) = 1 V; f = 20 Hz to 20 kHz THDmax Vi(cm)(rms) CMRR total harmonic distortion at maximum output current common-mode input voltage (RMS value) common-mode rejection ratio Rs = 5 k Rs = 0 ; note 4 f = 100 Hz to 20 kHz SVRR supply voltage ripple rejection Rs = 2 k; note 5 Rs = 2 k; note 5 f = 20 Hz to 20 kHz Notes 1. The channel separation is dependent on the capacitor C2 connected to the IN- input. The channel separation for low frequencies (<1 kHz) can be increased by using a larger capacitance for C2. 2. The frequency response is externally fixed by the input and output coupling capacitors. 3. The noise output voltage is measured in a bandwidth of 20 Hz up to 20 kHz, unweighted. 4. The common mode rejection ratio is measured at the output with a voltage source Vcm(rms) = 1 V and both Vi(L) and Vi(R) short-circuited according to Fig.9. The common mode rejection is dependent on the capacitor C2 connected to the IN- input. The common mode rejection for low frequencies (<1 kHz) can be increased by using a larger capacitance for C2. 5. Supply voltage ripple rejection is measured at the output using a ripple amplitude of 2 V (p-p). The source resistance Rs = 2 k. Vi(rms) = 1 V; RL = 150 noise output voltage total harmonic distortion -1 dB; note 2 -1 dB Rs = 5 k; note 1 PARAMETER CONDITIONS MIN. -0.5 70 - - 20 80 - - - - - - - 66 - 55 - 0 80 - - - 108 - 1.7 3.7 0.005 0.01 - - 80 80 - 60 TYP. MAX. +0.5 - 0.5 20 - 123 10 - 5 0.01 - 1 1 - - - - UNIT dB dB dB Hz kHz k V V % % % V dB dB dB dB
Vi(rms)(max) maximum input voltage (RMS value)
1996 Jul 29
8
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
APPLICATION INFORMATION General The TDA8575(T) is a two channel amplifier with differential input and single-ended output for use in car audio applications. The differential amplifier has a gain of 0 dB, a low distortion and a high common mode rejection.
TDA8575
Due to wiring resistance and noise coming from various electric devices in the automobile, performance loss will appear in those car audio applications where long connections between signal sources and amplifiers (or boosters) are necessary. To solve these problems the TDA8575(T) is developed (see Figs 7 and 8).
handbook, full pagewidth
VCC Vi tuner tape CD Vno+Vi long cable Vno car body noise car body
Vbat speaker
in
power amplifier
car body
MGE833
Fig.7 A typical noise problem in car audio systems.
handbook, full pagewidth
ground noise isolation amplifier VCC Vi tuner tape CD Vno+Vi + long cables Vno Vno car body noise car body car body
MGE834
VCC Vi+Vno / CMRR
Vbat speaker
in
-
power amplifier
Fig.8 The TDA8575(T) eliminates noise problems in car audio systems.
1996 Jul 29
9
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
handbook, full pagewidth
C1 220 nF Rs 5 k
INL+ 1 108 k INL- 5 360 k
12 OUTL
C3 2.2 F
VI
IV
RL 10 k
Vi(L) VCC 16 VCC VCC = 8.5 V
C2 8 SVRR 22 F Vcm
TDA8575(T)
REFERENCE C4 47 F 9 GND
C5 100 nF
Vi(R) INR- 6 Rs 5 k C1 220 nF INR+ 7 108 k
360 k
VI
IV 11 OUTR C3 2.2 F
RL 10 k
MGE835
Fig.9 Application circuit TDA8575(T).
1996 Jul 29
10
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
handbook, full pagewidth
C1 220 nF Rs 5 k Vi(L) C2 10 F
INL+ 1 108 k INL- 5 360 k
12 OUTL
C3 2.2 F
VI
IV
RL 10 k
VCC
16 VCC
VCC = 8.5 V
Vcm1
8 SVRR
TDA8575(T)
Vcm2 C2 10 F Vi(R) INR- 6 Rs 5 k C1 220 nF INR+ 7 108 k VI 360 k
REFERENCE C4 47 F 9 GND
C5 100 nF
IV 11 OUTR C3 2.2 F
RL 10 k
MGE836
Fig.10 Application circuit TDA8575(T) with a balanced signal source.
1996 Jul 29
11
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm
TDA8575
SOT109-1
D
E
A X
c y HE vMA
Z
16 9
Q A2 pin 1 index Lp
1 8
A1
(A 3)
A
L wM detail X
e
bp
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 0.24 0.23 L 1.05 0.041 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.0098 0.057 0.069 0.0039 0.049
0.019 0.0098 0.39 0.014 0.0075 0.38
0.028 0.004 0.012
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-23
1996 Jul 29
12
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
1996 Jul 29
13
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8575
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Jul 29
14
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8575
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Jul 29
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 615 800, Fax. +358 615 80920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. +30 1 4894 339/911, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 926 5361, Fax. +7 095 564 8323 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com (1) TDA8575_1.mif July 18, 1996 12:44 pm SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands
517021/10/01/pp16 Date of release: 1996 Jul 29 Document order number: 9397 750 00985

▲Up To Search▲

Price & Availability of TDA8575

	To Download TDA8575 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .